Thermal Conduction Chambers

Using thermal conduction rather than convection (as in standard test chambers) the Device Under Test (DUT) is attached directly to a thermal plate, which is heated and cooled as required. This technique is particularly effective when an intervention such as adjusting or tuning the DUT is necessary while it undergoes a temperature cycling regime. Mechanically Refrigerated Features: * Rapid electrical heating up to +130°C * Single-stage or cascade refrigeration to achieve temperatures down to -65°C * Air-cooled condenser * Range of thermal plate sizes from 170mm2 to 600mm2 * Compact, lightweight and portable - 4 rubber wheels * Under-bench versions available with umbilical connection to thermal plate * Rack-mount versions available to maximize available test laboratory space Cryogenically Refrigerated Features: * Rapid electrical heating up to +130°C * Liquid Nitrogen (or liquid CO2) to achieve temperatures down to -100°C * Very fast temperature ramp rates * Range of thermal plate sizes from 50mm2 to 280mm2 * Compact, lightweight and portable - sits on bench top