High Temperature Adhesive
Within this product range we are able to provide adhesives which are able to be applied in a range of bonding applications. 560 A thixotropic adhesive, when used alongside one of three hardners it is possible to vary the cure speed. This can be beneficial when bonding large structures. 551 A rapid setting, low viscosity, epoxy system designed in order to be suitable for use when the bond line thickness is critical. This product is available in a variety of different colours.Visit the Base Group website for more information on High Temperature Adhesive