Permabond Modified Epoxies - Ideal for Potting Applications

Permabond's MT range of modified epoxy adhesives offers the ideal solution to potting conundrums. Regular epoxy adhesives can be too rigid - sometimes putting too much stress on delicate electronics or PCBs potted inside, especially when subjected to a broad service temperature range. Polyurethane potting compounds often suffer from shrinkage and pull away from the outer wall of the electronics housing due to poor adhesion strength. Permabond's MT modified epoxies address both these issues as they are flexible, with low shrinkage and offer high adhesion strength. Long term durability, high temperature resistance and resistance to thermal shock make these products the ideal choice for potting and encapsulation applications. Products are two component and cure at room temperature. They can be dispensed via gun and mixing nozzle or through automated dispensing equipment. Low viscosity, flowable systems with self-levelling are available.